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VoltDRAM
VoltDRAM
| Capability Item | Volume Production | Sample Processing |
|---|---|---|
| Layer count | 1-68L | 64 Layer |
| Max thickness | 10mm (394mil) | 14mm (551mil) |
| Min line width/space (Inner layer) | 2.2mil / 2.2mil | 2.0mil / 2.0mil |
| Min line width/space (Outer layer) | 2.5mil / 2.5mil | 2.2mil / 2.2mil |
| Alignment capability (with core board) | ±25um | ±20um |
| Alignment capability (Inner layer alignment) | ±5mil | ±4mil |
| Max copper | 6Oz | 30 oz |
| Hole size (mechanical drilling) | ≥0.15mm (6mil) | ≥0.1mm (4mil) |
| Hole size (laser drilling) | 0.1mm (4mil) | 0.050mm (2mil) |
| Max unit size | 850mm X 570mm | 1000mm X 600mm |
| Max panel size | 1250mm X 570mm | 1320mm X 600mm |
| Aspect ratio (Unit) | 20:1 | 28:1 |
| Aspect ratio (Panel) | 25:1 | 35:1 |
| Material (Lead-free / Halogen-free) | EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF | |
| Material (High-speed PCB) | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13 Series, MW4000, MW2000, TU933 | |
| Material (High-frequency PCB) | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 | |
| Material (Others) | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000 | |
| Surface finished | HAL, HAL-LF, ENIG, IMMERSION TIN, OSP, IMMERSION SILVER, GOLD FINGER, Hard Gold / Soft Gold Plating | |
| Special technology | Blind & buried holes, Via in pad, Semi-plating holes, Counterbore, Step mounting holes, mixed RF PCB, Busbar PCB | |
We provide multiple flexible shipping solutions for your orders:
| Layers | Sample Shortest Lead Time | Sample Standard Lead Time | Mass Production Lead Time |
|---|---|---|---|
| 2 layer | 24 h | 3 days | 6-7 days |
| 4 layer | 36 h | 5 days | 8-10 days |
| 6 layer | 48 h | 5 days | 8-12 days |
| 8 layer | 72 h | 5 days | 9-12 days |
| 10 layer | 4 days | 7 days | 14 days |
| 12 layer | 4 days | 7 days | 16 days |
| 14 layer | 5 days | 8 days | 16 days |
| 16 layer | 5 days | 9 days | 18 days |
| 18 layer | 7 days | 10 days | 18 days |
| 20 layer and above | To be negotiated | To be negotiated | To be negotiated |
We process standard industry formats including:
RS-274-X, RS-274-D, CAD, DXP, Protel 99 SE, PADS, GC-CAM
We specialize in multilayer boards (up to 68 layers), high TG thick copper boards, impedance boards, high-frequency/high-speed boards, buried blind via boards, HDI, rigid-flex boards, aluminum-based dielectric boards, and customized solutions.
For 2-layer PCBs, the shortest prototype turnaround time is 24 hours. For 4 to 6 layers, it is 36 to 48 hours. Depending on the complexity and layer count, sample deliveries generally range from 3 to 10 days.
We support standard industry file formats, including RS-274-X, RS-274-D, CAD, DXP, Protel 99 SE, PADS, and GC-CAM files.
We support premium high-speed materials like Megtron6, Megtron4, Megtron7, and TU872SLK, as well as high-frequency options including Rogers series (Ro3003, Ro4350B, etc.), CLTE, Genclad, and RF35.
Our manufacturing processes are fully certified under ISO 9001:2015, ISO 14001:2015, IATF 16949:2016, UL, CQC, and "National Military Standard". Our shipping and acceptance criteria follow strict customer guidelines and IPC standards.
We offer air shipping (via UPS, DHL, TNT, CTS, and FEDEX), railway cargo, seaborne logistics, as well as customized shipping methods chosen by our clients.
