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Processor CPU Cooler LGA4926 300W Server Heat Sink 4U Server Air Cooling
Processor CPU Cooler LGA4926 300W Server Heat Sink 4U Server Air Cooling
Processor CPU Cooler LGA4926 300W Server Heat Sink 4U Server Air Cooling
Processor CPU Cooler LGA4926 300W Server Heat Sink 4U Server Air Cooling
Processor CPU Cooler LGA4926 300W Server Heat Sink 4U Server Air Cooling
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Processor CPU Cooler LGA4926 300W Server Heat Sink 4U Server Air Cooling
Processor CPU Cooler LGA4926 300W Server Heat Sink 4U Server Air Cooling
Processor CPU Cooler LGA4926 300W Server Heat Sink 4U Server Air Cooling
Processor CPU Cooler LGA4926 300W Server Heat Sink 4U Server Air Cooling
Processor CPU Cooler LGA4926 300W Server Heat Sink 4U Server Air Cooling

Processor CPU Cooler LGA4926 300W Server Heat Sink 4U Server Air Cooling

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Product Description

Product Description

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Specification

Type CPU radiator
Texture of material Copper base + aluminum fins + 6 heat pipes
Bearing type Double ball bearings
Heat dissipation method Heat pipe

Packing & Delivery

Packing Details 1
Packing Details 2

Capabilities & Expertise

Focusing on electronic consumer and electronic component channels, and specializing in various IC, IT, and electronic accessories. Stable and long-term relationships have been established with world-renowned integrated circuit manufacturers and direct customers of integrated circuits. This enables access to the most advanced technology that surpasses inventory control. All DRAM module products play an important role in the OEM market.

FAQ

What materials are used in the construction of the CPU radiator?
The radiator is constructed with a high-performance copper base combined with aluminum fins and 6 integrated heat pipes for optimized heat conduction.
What type of bearing technology does this CPU radiator feature?
It is equipped with double ball bearings, which ensure outstanding reliability, low noise levels, and a significantly extended operational lifespan.
What is the primary method of heat dissipation?
The primary method utilizes high-efficiency heat pipes designed to transfer thermal energy rapidly away from the processor to the aluminum cooling fins.
Are your products suitable for OEM application channels?
Yes. All specialized components and DRAM modules are engineered for seamless integration and play a significant role in OEM markets globally.
How are the products packaged to ensure secure transportation?
All items undergo standard industrial packaging procedures using secure materials, ensuring that they remain completely protected against shocks and vibrations during transit.

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