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VoltDRAM
| Category | Volume Production | Sample Processing |
|---|---|---|
| Layer count | - | 1-68L (64 Layer) |
| Max thickness | 10mm (394mil) | 14mm (551mil) |
| Min line width/space (Inner layer) | 2.2mil / 2.2mil | 2.0mil / 2.0mil |
| Min line width/space (Outer layer) | 2.5mil / 2.5mil | 2.2mil / 2.2mil |
| Alignment capability (core board) | ±25um | ±20um |
| Inner layer alignment | ±5mil | ±4mil |
| Max copper | 6Oz | 30 oz |
| Hole size (mechanical drilling) | ≥0.15mm (6mil) | ≥0.1mm (4mil) |
| Hole size (laser drilling) | 0.1mm (4mil) | 0.050mm (2mil) |
| Max size (Unit size) | 850mm X 570mm | 1000mm X 600mm |
| Max size (Panel size) | 1250mm X 570mm | 1320mm X 600mm |
| Aspect ratio (Unit size) | 20:1 | 28:1 |
| Aspect ratio (Panel size) | 25:1 | 35:1 |
| Lead-free / Halogen-free Materials | EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF | |
| High-speed PCB Material | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13 Series, MW4000, MW2000, TU933 | |
| High-frequency PCB Material | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 | |
| Other Materials | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000 | |
| Surface Finished | HAL, HAL-LF, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Hard Gold/Soft Gold Plating | |
| Special technology | Blind & buried holes, Via in pad, Semi-plating holes, Counterbore, Step mounting holes, drill Mixed RF PCB, Busbar PCB | |
PCB orders are shipped via the following options:
| Layer | Sample Shortest Lead Time | Sample Standard Lead Time | Mass Production Lead Time |
|---|---|---|---|
| 2 layer | 24 h | 3 days | 6-7 days |
| 4 layer | 36 h | 5 days | 8-10 days |
| 6 layer | 48 h | 5 days | 8-12 days |
| 8 layer | 72 h | 5 days | 9-12 days |
| 10 layer | 4 days | 7 days | 14 days |
| 12 layer | 4 days | 7 days | 16 days |
| 14 layer | 5 days | 8 days | 16 days |
| 16 layer | 5 days | 9 days | 18 days |
| 18 layer | 7 days | 10 days | 18 days |
| 20 layer and above | To be negotiated | To be negotiated | To be negotiated |